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Solution prepreg is the basic process of coating (dipping) a composite web (glass, carbon, aramid, etc) with a resin in order to impregnate the web and make prepreg. This process is used for Printed Circuit boards (Copper Clad Laminates – CCL) and Structural Composites (traditional prepreg). Solution prepreg can be for woven webs, paper, or unidirectional tows to make a tape.
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